반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Viscoelastic Analysis of an Interface Edge Crack in a Bonded Polymeric Film

  • Lee, Sang-Soon (Korea University of Technology and Education, School of Mechatronics Engineering)
  • 투고 : 2010.08.16
  • 심사 : 2010.09.15
  • 발행 : 2010.09.30
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초록

Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

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참고문헌

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