Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
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Synthesis and PSA Properties of Acryl Modified Resin for Semiconductor Wafer

반도체 웨이퍼용 아크릴 변성 수지의 합성 및 점착 특성

  • Sim, Jong Bae (Department of Chemical Engineering, College of Engineering, Chungnam National University) ;
  • Shin, Kyoung Sub (Department of Chemical Engineering, College of Engineering, Chungnam National University) ;
  • Hwang, Taek Sung (Department of Chemical Engineering, College of Engineering, Chungnam National University)
  • Received : 2010.03.03
  • Accepted : 2010.05.25
  • Published : 2010.06.30
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Abstract

In this study, acryl resin PSA containing hydroxyl group based on 2-EHA (2-ethyl hexyl acrylate), 2-EHMA (2-ethyl hexyl methacrylate), 2-HEA (2-Hydroxy ethyl acrylate), acrylic acid was synthesized and then, isocyanate modified acryl resin PSA prepared with adduct reaction according to the amount of MOI (Methacryloyloxyethyl isocyanate) or 2-isocyanatoethyl methacrylate that can improve the curing property. This research shows that the initial PSA and peel adhesion are decreased according to the increase of the amount of the MOI and isocyanate curing agent. After UV irradiating, the peel adhesion is decreased with increasing the amount of the MOI (Methacryloyloxyethyl isocyanate) and isocyanate curing agent, because of the high curing property.

본 연구는 2-EHA (2-ethyl hexyl acrylate), 2-EHMA (2-ethyl hexyl methacrylate), 2-HEA (2-Hydroxy ethyl acrylate), acrylic acid 모노머를 이용하여 hydroxy기를 가진 아크릴 수지 점착제를 합성한 후 MOI (Methacryloyloxyethyl isocyanate) 또는 2-isocyanatoethyl methacrylate의 투입량 조절을 통한 경화특성을 향상시킬 수 있는 adduct 반응을 시킨 이소시아네이트 변성 아크릴 수지 점착제를 제조하였다. 시험 결과 초기 점착력과 박리 접착강도는 MOI와 가교제인 isocyanate의 양이 증가할수록 감소하였다. UV 조사후, MOI와 가교제인 isocyanate의 양이 증가할수록 높은 경화특성 때문에 박리접착 강도는 좀 더 낮아지는 결과를 가져왔다.

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