한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제19권5호
  • /
  • Pages.616-621
  • /
  • 2010
  • /
  • 2508-5093(pISSN)
  • /
  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
권호 표지

공기 냉각 방식의 래핑을 이용한 구리 기판 연마 공정 개발

Thick Copper Substrate Fabrication by Air-Cooled Lapping and Post Polishing Process

  • 이호철 (한밭대학교 기계공학부) ;
  • 김동준 (한밭대학교 기계공학과) ;
  • 이현일 (한밭대학교 기계공학과)
  • 투고 : 2010.07.27
  • 심사 : 2010.10.01
  • 발행 : 2010.10.15
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초록

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

키워드

참고문헌

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