References
- Wang, X.; Liu, J.; Feng, X.; Guo, M.; Sun, D. Mater. Chem. Phys. 2008, 112, 319. https://doi.org/10.1016/j.matchemphys.2008.05.035
- Kim, S. W.; Kim, M.; Lee, W. Y.; Hyeon, T. J. Am. Chem. Soc. 2002, 124, 7642. https://doi.org/10.1021/ja026032z
- Wang, J.; Chen, Q.; Zeng, C.; Hou, B. Adv. Mater. 2004, 16, 137. https://doi.org/10.1002/adma.200306136
- Maity, A.; Sardar, P. S.; Ghosh, S.; Biswas, M. J. Appl. Polym. Sci. 2007, 104, 3837. https://doi.org/10.1002/app.25974
- Stejskal, J.; Quadrat, O.; Sapurina, I.; Zemek, J.; Drelinkiewicz, A.; Hasik, M.; Krivka, M.; Prokes, J. Eur. Poly. J. 2002, 38, 631. https://doi.org/10.1016/S0014-3057(01)00241-5
- Shim, G. H.; Han, M. G.; Sharp-Norton J. C.; Creager, S. E.; Foulger, S. H. J. Mater. Chem. 2008, 18, 594. https://doi.org/10.1039/b712766a
- Wang, D. W.; Li, F.; Zhao, J.; Ren, W.; Chen. Z. G.; Tan, J.; Wu, Z. S.; Gentle, I.; Lu, G. Q.; Cheng, H. M. ACS NANO 2009, 3(7), 1745. https://doi.org/10.1021/nn900297m
- Sowwanl, M.; Farounl, M.; Musal, I.; Ibrahiml, I.; Makharza, S.; Sultan, W.; Dweik, H. Int. J. Phys. Sci. 2008, 3, 144.
- Dubois, J. E.; Desbene-Monvernay, A.; Lacaze, P. C. J. Electroanal. Chem. 1982, 132, 177. https://doi.org/10.1016/0022-0728(82)85016-X
- Papez, V.; Inganas, O.; Cimrova, V.; Nespurek, S. J. Electroanal. Chem. 1990, 282, 123. https://doi.org/10.1016/0022-0728(91)85093-5
- Lee, C. J.; Kim, D. H.; Oh, J. M.; Park, K. H.; Kim, N.; Ji, B. S.; Lyoo, W. S. J. Appl. Polym. Sci. 2000, 76, 1558. https://doi.org/10.1002/(SICI)1097-4628(20000606)76:10<1558::AID-APP10>3.0.CO;2-I
- Chun, H.; Moon, I. K.; Shin, D. H.; Kim, N. Chem. Mater. 2001, 13, 2813. https://doi.org/10.1021/cm000913s
- He, G.; Chang, S. C.; Chen, F. C.; Li, Y.; Yang, Y. Appl. Phys. Lett. 2002, 81, 1509. https://doi.org/10.1063/1.1502442
- Penwell, R. C.; Ganguly, B. N.; Smith, T. W. J. Polym. Sci. Macromol. Rev. 1978, 13, 63. https://doi.org/10.1002/pol.1978.230130102
- Okamoto, K. I.; Yamada, M.; Itaya, A.; Kimara, T.; Kusabayashi, S. Macromolecules 1976, 9, 645. https://doi.org/10.1021/ma60052a023
- Tanahashi, M.; Hirose, M.; Lee, J. C.; Takeda, K. Polym. Adv. Technol. 2006, 17, 981. https://doi.org/10.1002/pat.841
- Zheng, Y. P.; Zheng, Y.; Ning, R. C.; Mater. Lett. 2003, 57, 2940. https://doi.org/10.1016/S0167-577X(02)01401-5
- Naganuma, T.; Kagawa, Y. Compos. Sci. Technol. 2002, 62, 1187. https://doi.org/10.1016/S0266-3538(02)00059-3
- Hong, R. Y.; Chen, L. L.; Li, J. H.; Li, H. Z.; Zheng, Y.; Ding, J. Polym. Adv. Technol. 2007, 18, 901. https://doi.org/10.1002/pat.926
- Kang, S.; Hong, S. I.; Choe, C. R.; Park, M.; Rim, S.; Kim, J. Polymer 2001, 42, 879. https://doi.org/10.1016/S0032-3861(00)00392-X
- Kotoky, T.; Dolui, S. K. Colloid. Polym. Sci. 2006, 284, 1163. https://doi.org/10.1007/s00396-006-1498-3
- Hong, R. Y.; Fu, H. P.; Zhang, Y. J.; Liu, L.; Wang, J.; Li, H. Z.; Zheng,Y. J. Appl. Polym. Sci. 2007, 105, 2176. https://doi.org/10.1002/app.26164
- Mathew, G.; Huh, M. Y.; Rhee, J. M.; Lee, M. H.; Nah, C. Polym. Adv. Technol. 2004, 15, 400. https://doi.org/10.1002/pat.482
- Sarac, A. S.; Sezer, E.; Ustamehmetoglu, B. Polym. Adv. Technol. 1997, 8, 556. https://doi.org/10.1002/(SICI)1099-1581(199709)8:9<556::AID-PAT686>3.0.CO;2-L
- Odian, G. Principles of Polymerization; third ed., John Wiley & Sons: New York, 1991; p 335.
- Basavaraja, C.; Pierson, R.; Vishnuvardhan, T. K.; Huh, D. S. Eur. Poly. J. 2008, 44, 1556. https://doi.org/10.1016/j.eurpolymj.2008.02.015
- Basavaraja, C.; Pierson, R.; Kim, J. H.; Huh, D. S. Bull. Korean Chem. Soc. 2008, 29(9), 1699. https://doi.org/10.5012/bkcs.2008.29.9.1699
- Basavaraja, C.; Choi, Y. M.; Park, H. T.; Huh, D. S.; Lee, J. W.; evanasiddappa, M.; Raghavendra, S. C.; Khasim, S.; and Vishnuvardhan, T. K. Bull. Korean Chem. Soc. 2007, 28(7), 1104. https://doi.org/10.5012/bkcs.2007.28.7.1104
- Kirkpatrick, S. Rev. Mod. Phys. 1973, 45, 74.
- Stauffer, D.; Aharony, A. Introduction to percolation theory; Taylor and Francis: London, 1992; p 89-113.
- Clingerman, M. L.; King, J. A.; Schulz, K. H.; Mayers, J. D. J. Appl. Polym. Sci. 2002, 83, 1341. https://doi.org/10.1002/app.10014
- Cheng, G. S.; Huh, J. W.; Zhang, M. Q.; LI, M. W.; Xiao, D. S.; Rong, M. Z. Chinese Chem. Lett. 2004, 15(12), 1501.
- Weng, W. G.; Chen, G. H.; Wu, D. J.; Yan, W. L. Composite Interface 2004, 11(2), 131. https://doi.org/10.1163/156855404322971404
- Zheng, W.; Wong, S. C. Compos. Sci. Technol. 2003, 63, 225. https://doi.org/10.1016/S0266-3538(02)00201-4
- Chen, X. M.; Shen, J. W.; Huang, W. Y. J. Mater. Sci. Lett. 2002, 21, 213. https://doi.org/10.1023/A:1014708808230
- Li, J.; Kim, J. K.; Sham, M. L. Macromol. Compos. Sci. Technol 2007, 67(2), 296. https://doi.org/10.1016/j.compscitech.2006.08.009
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