References
- J.J. Yang, "Electrostatic Discharge Protection Circuit Employing MOSFETs Having Double ESD Implantations," U.S. Patent 6 040 603, Mar. 21, 2000.
-
M.D. Ker and C.H. Chuang, "ESD Implantations in 0.18
$\mu$ m Salicided CMOS Technology for On-Chip ESD Protection with Layout Consideration," Proc. Int. Symp. Physical and Failure Analysis of Integrated Circuits, 2001, pp. 85-90. - K.H. Oh et al., "Analysis of Nonuniform ESD Current Distribution in Deep Submicron NMOS Transistors," IEEE Trans. Electron Devices, vol. 49, no. 12, Dec. 2002, pp. 2171-2182. https://doi.org/10.1109/TED.2002.805049
- T.Y. Chen and M.D. Ker, "Investigation of the Gate-Driven Effect and Substrate-Triggered Effect on ESD Robustness of CMOS Devices," IEEE Trans. Device Mater. Reliability, vol. 1, no. 4, Dec. 2001, pp. 190-203. https://doi.org/10.1109/7298.995833
- Jin-Young Choi, "AC Modeling of the ggNMOS ESD ProtectionDevice," ETRI Journal, vol. 27, no. 5, Oct. 2005, pp. 628-634. https://doi.org/10.4218/etrij.05.0104.0196
- T.Y. Kim et al., "Degradation Behavior of 850 nm AlGaAs/GaAs Oxide VCSELs Suffered from Electrostatic Discharge," ETRI Journal, vol. 30, no. 6, Dec. 2008, pp. 833-843. https://doi.org/10.4218/etrij.08.0108.0148
- O. Semenov et al., "Novel Gate and Substrate Triggering Techniques for Deep Sub-micron ESD Protection Devices," Microelectronics Journal, no. 37, no. 6, Sept. 2005, pp. 526-533. https://doi.org/10.1016/j.mejo.2005.07.019
- O. Semenov et al., ESD Protection Device and Circuit Design for Advanced CMOS Technologies, Springer, United States, 2008.
- J. Barth et al., "TLP Calibration, Correlation, Standards, and New Techniques," Proc. EOS/ESD Symp., 2000, pp. 85-96.
- W. Stadler et al., "Does the TLP Failure Current Obtained by Transmission Line Pulsing Always Correlate to Human Body Model Tests-" Proc. EOS/ESD Symp., 1997, pp. 336-372.
- G. Notermans, P. de Jong, and F. Kuper, "Pitfalls When Correlating TLP, HBM, and MM Testing," Proc. EOS/ESD Symp., 1998, pp. 170-176.
Cited by
- Improvement of electrostatic discharge current-handling capability for high-voltage multi-finger nLDMOS devices with self-triggered technique vol.35, pp.6, 2009, https://doi.org/10.1088/1361-6641/ab807d