전기학회논문지 (The Transactions of The Korean Institute of Electrical Engineers)

  • 제58권9호
  • /
  • Pages.1775-1777
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  • 2009
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  • 1975-8359(pISSN)
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  • 2287-4364(eISSN)
대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

용융법에 의한 Bi계 Thick Film 합성

A Study on the Fabrication of Bi System Thick Film Using Melting Process

  • 이상헌 (선문대 공대 전자공학부)
  • 발행 : 2009.09.01
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초록

BiSrCaCuO films were prepared on MgO single substerate at $885^{\circ}C$ by melt process. The films showed superconductivity above liquid nitrogen temperature (Tc= 96K). To investigate the effect of a melting temperature on the forming of the surface texturing, the samples were prepared under various temperature. The used powder was of high Tc phase. It is implies that the origin of the properties due to the heat treatment.

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참고문헌

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