한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제18권4호
  • /
  • Pages.362-368
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  • 2009
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  • 2508-5093(pISSN)
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  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
권호 표지

플립칩의 반복 굽힘 시험 시 파손 특성에 관한 실험적 연구

An Experimental Study on the Failure Characteristics of Flip Chips in Cyclic Bending Test

  • 이용성 (서울산업대 NID 융합기술전문대학원) ;
  • 정종설 (서울산업대 NID 융합기술전문대학원) ;
  • 김홍석 (서울산업대 기계공학과) ;
  • 신기훈 (서울산업대 기계공학과)
  • 발행 : 2009.08.15
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초록

In general, circuit board assemblies experience various mechanical loadings during assembly and in actual use. The repeated cyclic bending can cause electrical failures due to circuit board cracks, solder interconnects cracks, and the component cracks. In this paper, we report on the failure characteristics of semiconductor chips under the repeated cyclic bending. We first describe a new 4-point bending tester, which is developed according to JEDEC standard No. 22B113. The performance of the tester is then estimated through actual experiments. Test results reveal that the cracks first occur on the outer balls around 20,000 cycles and gradually propagate to the inner balls where cracks are found around 70,000 cycles.

키워드

참고문헌

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