가공정도 향상을 위한 평면 연삭기의 설계 개선

Modifications of a Grinding Machine Structure for the Improved Precision Machining

Among a few items with world wide competitiveness are the semiconductor and the LCD. Grinding/polishing is the most significant process in manufacturing semiconductor wafers and LCD panels, the most critical quality of which is the precision rate of the machined surfaces. It is well known that the control of the vibrations is the major factor in maintaining superb machined surfaces. In this paper the dynamic properties of a grinding machine have been investigated through the frequency analysis test and the computer simulation to deduce ideas of design modifications for improved stability. The alterations have been applied to the simulation model, which is supposed to have identical dynamic property with the original structure, to identify the effects and to finally achieve the satisfactory level of stability. The result shows that the machine can have much improved stability with relatively simple design changes, and also can improve the surface quality of the products.