한국산업융합학회 논문집 (Journal of the Korean Society of Industry Convergence)
- 제12권2호
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- Pages.99-105
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- 2009
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- 1226-833X(pISSN)
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- 2765-5415(eISSN)
가공정도 향상을 위한 평면 연삭기의 설계 개선
Modifications of a Grinding Machine Structure for the Improved Precision Machining
- 손재율 ((주)씨아이이에스대구) ;
-
노승훈
(금오공과대학교 기계공학부) ;
- 임요한 ((주)피엔티, 기술팀) ;
- 이종형 (금오공과대학교 기계공학부) ;
-
이재열
(영남이공대학 창업보육센터) ;
- 송은석 (금오공과대학교 대학원) ;
- 이태훈 (금오공과대학교 대학원)
- Shon, Jae-Yul (CIES Daegu co., ltd.) ;
-
Ro, Seung-Hoon
(School of Mechanical Engineering, Kumoh Institute of Technology) ;
- Lim, Yo-Han (Engineering Team, Pnt co., ltd.) ;
- Lee, Jong-Hyung (School of Mechanical Engineering, Kumoh Institute of Technology) ;
-
Lee, Jae-Yul
(Business Incubation Center, Yeungnam College of Science & Technology) ;
- Song, Eun-Seok (Graduate School of Kumoh Institute of Technology) ;
- Lee, Tae-Hoon (Graduate School of Kumoh Institute of Technology)
- 투고 : 2009.03.21
- 심사 : 2009.05.22
- 발행 : 2009.05.22
초록
Among a few items with world wide competitiveness are the semiconductor and the LCD. Grinding/polishing is the most significant process in manufacturing semiconductor wafers and LCD panels, the most critical quality of which is the precision rate of the machined surfaces. It is well known that the control of the vibrations is the major factor in maintaining superb machined surfaces. In this paper the dynamic properties of a grinding machine have been investigated through the frequency analysis test and the computer simulation to deduce ideas of design modifications for improved stability. The alterations have been applied to the simulation model, which is supposed to have identical dynamic property with the original structure, to identify the effects and to finally achieve the satisfactory level of stability. The result shows that the machine can have much improved stability with relatively simple design changes, and also can improve the surface quality of the products.