Journal of Welding and Joining

  • 제27권3호
  • /
  • Pages.10-16
  • /
  • 2009
  • /
  • 2466-2232(pISSN)
  • /
  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지
DOI QR코드

DOI QR Code

3차원 패키징 기술개발에 따른 PoF 기반 가속 실장수명 예측

PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development

  • 홍원식 (전자부품연구원 고장물리연구센터) ;
  • 오철민 (전자부품연구원 고장물리연구센터)
  • 발행 : 2009.06.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

키워드

참고문헌

  1. H. E. Lee, et all, "Packaging Industry Trend and Suggestion", IITA, IT Component Monitoring Report, 08-20 (2008) (in Korean)
  2. D. G. Kim, J. W. Kim, S. S. Ha, J. P. Jung, Y. E. Shin, J. H. Moon, S. B. Jung, "Fabrication of Through-hole Interconnect in Si Wafer for 3D Package", Journal of KWS, 24-2 (2006), 172-178 (in Korean)
  3. J. M. Kim, J. P. Jung, S. H. Kim, J. H. Park, "Packaging Technology in Electronics and 3-dimensional Stacking Packaging", Journal of KWS, 23-2 (2005), 129-137 (in Korean)
  4. Y. E. Shin, J. M. Kim, Y. T. Kim, J. S. Kim, "High ensity Stacking Process and Reliability of Electronic Packaging", Journal of KWS, 24-2 (2006), 118-124 (in Korean)
  5. S. H. Hong, K. S. Kim, N. Zhou, J. P. Jung, "3 Dimensional Packaging Technology Using Via", Journal of KWS, 24-2 (2006), 137-141 (in Korean)
  6. W. S. Hong, C. M. Oh, N. C. Park, B. S. Song, S, B. Jung, 'Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement, Journal of KWS, 25-2 (2007), 118-125 (in Korean)
  7. S. Y. Choi, "Reliability Test Method and Technical Trend of Electronic Package", Journal of KSME, 48-5 (2008), 34-38 (in Korean)
  8. B. Pfahi, "Packaging Road map : The impact of miniaturization", iNEMI Technology Forum (2007)
  9. Reichl, Fraunhofer IZM, Berlin Germany, www.izm.fraunhofer.de
  10. Amkor Technology, "3D & Stacked Die Packaging", Technology Solution, TS 104D (2009), www.amkor.com
  11. Waytronx, Inc., "Waytronx 3C for 3D Packaging Roadmap", White Paper (2007), www.waytronx.com
  12. Steven Koester, "Ultra Thin Wafer Processing Solutions", Semiconductor International Webcast, June 20 (2007)
  13. Michael Kanellos, "Processor, Memory May Marry in Future Computer", CNET News.com, Sept. 28 (2006)
  14. Samsung Electronics Co., Ltd., press release, "Samsung Electronics Develops New, Highly Efficient Stacking Process for DRAM", April 22 (2007)
  15. S. W. Seo, G. S. Kim, "The Film Properties and Deposition Process of TSV Inside for 3D Interconnection", J. Microelectronics & Packaging Soc., 15-3(2008), 47-52
  16. Sony Co., Sony Semiconductor, 'Quality and Reliability Hanbook', 1st ed., Kanagawa Jpn. (2000)
  17. M. Ohring, 'Reliability and Failure of Electronic Materials and Devices', Academic Press, San Diego, 17-36 (1998)
  18. P. L. Martin, "Electronic Failure Analysis Handbook", McGRAW-HILL, New York (1999)
  19. A. Dasgupta, M. Pecht, "Material Failure Mechanisms and Damage Models", IEEE Trans. Reliability, 40-5 (1991), 531-536 https://doi.org/10.1109/24.106769
  20. J. W. Evans et al., "Reliability Assessment for Development of Microtechnologies", Microsystem Technologies 3 (1997), 145-154
  21. W. S. Hong, N. C. Park, C. M. Oh, "Accelerated Thermo-Mechanical Fatigue Life of Pb-free Solder Joints for PZT Ceramic Resonator", Kor. J. Mater. Res., 19-6 (2009) https://doi.org/10.3740/MRSK.2009.19.6.337
  22. W. Nelson, "Accelerated Testing", John Wiley & Sons (1990)
  23. W. S. Hong, W. S. Kim, N. C. Park and K. B. Kim, "Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement", Journal of KWS, 25-2 (2007), 184 (in Korean)
  24. JEDEC Standard, Application Specific Qualification Using Knowledge Based Test Methodology, JESD94.01, USA (2007)
  25. Alan Liu, "Mechanics and Mechanisms of Fracture", ASM International, Ohio (2005), 105-110

피인용 문헌

  1. Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions vol.31, pp.5, 2013, https://doi.org/10.5781/KWJS.2013.31.5.59