References
- Charles A. Harper, Electronic Packaging & interconnection Handbook, Second Edition, McGraw Hill, 1997
- Engelmeier, W., 'Surface Mount Solder Joint Reliability: Issue, Design, Testing, Prediction' Workshop Notes, Engelmaier Associate, Inc., Mendahm, NJ, 1995
- Dave S. Steinburg, Vibration Analysis for Electronic Equipment, Second Edition, Wiley Inter-Science, 1980
- John W. Miles, 'On Structural Fatigue Under Random Loading', Journal of the Aeronautical Science, pp.753, 1954 https://doi.org/10.2514/8.3199
- John Parry, Chris Bailey, Chris Aldham, 'Multiphysics Modeling for Electronic Design', Proceedings of ITHERM Conference, Las Vegas, May 2000, pp.86-93
- R. Darveaux et al., 'Solder Joint Fatigue Life Model', Design and Reliability of Solders and Solder Interconnection, 1997, pp.213-218, Pub. TMS
- H. Lu, C. Bailey, M. Dusek, C. Hunt and J. Nottay, 'Modeling the Fatigue Life Prediction of Solder Joints for Surface Mount Resistor', International Symposium on Electronic Materials and Packaging, Hong Kong, pp. 136-143, Pub. IEEE, ISBN 0-7803-6654-9, 2000
- Military Specification Microcircuits, Linear, Adjustable, Positive, Voltage Regulators, Monolithic Silicon, MIL-M-38510/117A, March 1980