Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
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Property and Polymerization of Hi-solid PSA's using Seeded Polymerization

Seed 중합을 이용한 고고형분 수용성 점착제의 합성과 물성

  • Jung, Young Sik (Department of Chemical Engineering, Dong-A University) ;
  • Min, Seong-Kee (Department of Polymer Engineering, Pukyong National University) ;
  • Seul, Soo Duk (Department of Chemical Engineering, Dong-A University)
  • 정영식 (동아대학교 공과대학 화학공학과) ;
  • 민성기 (부경대학교 공과대학 고분자공학과) ;
  • 설수덕 (동아대학교 공과대학 화학공학과)
  • Received : 2009.11.26
  • Accepted : 2009.12.11
  • Published : 2009.12.30
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Abstract

The viscosity for hi-solid pressure sensitive adhesive to improve water soluble low viscosity pressure sensitive adhesive polymerized using seeded polymerization. While seed binder polymerizing it produces an optimum polymerization condition, and acrylic acid and seed binder concentration changed were measurement of viscosity variation and adhesive power at the substrate (SUS420J) as flowing results. In adhesive polymerization, seed binder concentration 7 wt%/monomer was recovered 60% of solid content, 2,100 cps of low viscosity and clear adhesive film. When acrylic acid content was 4 wt%/monomer, it was turned excellent adhesive power and holding power.

고 고형분 점착제의 점도 개선을 위해 seed 중합을 이용하여 수용성 저점도 점착제를 중합하였다. Seed 바인더 중합 중 최적 중합 조건을 산출하고, 점착제 중합 시 seed 바인더와 acrylic acid의 함량을 변화시켜 점도변화와 피착면에 대한 점착박리강도를 측정하여 다음과 같은 결과를 얻었다. 점착제 중합에서 seed 바인더의 함량이 7 wt%/monomer일 때 60%의 고형분에서 2,100 cps의 낮은 점도를 나타내고 평활한 점착제 필름을 제조할 수 있었다. Acrylic acid함량 변화에 따른 기계적 물성 측정에서는 4 wt%/monomer의 acrylic acid를 사용 했을 때 우수한 점착박리강도와 유지력을 나타내었다.

Keywords

References

  1. C. Wangman., Adhesives Age, 20(4), 23 (1977).
  2. K. C. Stueben., Adhesives Age, 20(6) 16 (1977).
  3. F. M. Mussur., Adhesives Age, 19(17), 38 (1976).
  4. A. J. Kinloch, "Adhesion and Adhesives", Science and Technology (1986).
  5. P. Tordjeman and E. Papon, J. Appl. Polym. Sci., 38, 1201 (2000). https://doi.org/10.1002/(SICI)1099-0488(20000501)38:9<1201::AID-POLB12>3.0.CO;2-#
  6. W. W. Mooncai, Adhesives Age, 31, 33 (1998).
  7. F. T. Sanderson, Adhesives Age, 26, 26 (1983).
  8. E. B. William, Adhesives Age, 28, 28 (1985).
  9. A. J. Kinloch, "Adhesion and Adhesives", Science and Technology (1986).
  10. A. J. Backhouse, U. S. Patent 4, 403, 003 (1983).
  11. K Y. Bing and Y. I Park, Polymer Science and Technology, 6(6), 585 (1995).
  12. S. Donatas, Handbook of Pressure-Sensitive Technology and Applications, p. 444 (2002).
  13. J. I. Amalvy, Journal of Applied Polymer Science, 59, 339 (1996). https://doi.org/10.1002/(SICI)1097-4628(19960110)59:2<339::AID-APP18>3.0.CO;2-R
  14. O. Ben-Zion and A. Nussinovitch, J. Adehsion Sci. Technol., 16, 599 (2002). https://doi.org/10.1163/156856102760070394
  15. D. H. Sim and S. D. Seul, Polymer (Korea), 33, 1 (2009).