Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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A Reliability and warpage of wafer level bonding for CIS device using polymer

폴리머를 이용한 CIS(CMOS Image Sensor) 디바이스용 웨이퍼 레벨 접합의 warpage와 신뢰성

  • Park, Jae-Hyun (Department of Electronic Engineering, Kangnam University) ;
  • Koo, Young-Mo (ESIP R&D Lab., EPWorks Co., Ltd.) ;
  • Kim, Eun-Kyung (Graduate School of NID Fusion Tech., Seoul National University of Technology) ;
  • Kim, Gu-Sung (Department of Electronic Engineering, Kangnam University)
  • 박재현 (강남대학교 전자공학과) ;
  • 구영모 ((주)이피웍스 ESIP 연구소) ;
  • 김은경 (서울산업대학교 NID융합기술대학원) ;
  • 김구성 (강남대학교 전자공학과)
  • Published : 2009.03.30
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Abstract

In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

Keywords

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