Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Structure and Properties of Polymer Infiltrated Alumina Thick film via Inkjet Printing Process

잉크젯 프린팅 공정에 의한 유전체 후막의 제조 및 특성

  • 장헌우 (요업기술원 미래융복합세라믹본부) ;
  • 구은회 (요업기술원 미래융복합세라믹본부) ;
  • 김지훈 (요업기술원 미래융복합세라믹본부) ;
  • 김효태 (요업기술원 미래융복합세라믹본부) ;
  • 윤영준 (요업기술원 미래융복합세라믹본부) ;
  • 황해진 (인하대학교 세라믹공학과) ;
  • 김종희 (요업기술원 미래융복합세라믹본부)
  • Published : 2009.04.01
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Abstract

We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.

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References

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