Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on the Cooling of High Power LED Component using Flat Heat Pipe

히트파이프를 사용한 조명용 LED의 냉각에 대한 연구

  • Jang, Young-Woon (Graduate School, Department of Mechanical Design Engineering, Chonbuk National University) ;
  • Kim, Byung-Ho (TTM) ;
  • Im, Ik-Tae (Department of Mechanical Design Engineering, Chonbuk National University)
  • 장영운 (전북대학교 대학원 기계설계공학부) ;
  • 김병호 (TTM(주)) ;
  • 임익태 (전북대학교 공과대학 기계설계공학부)
  • Published : 2009.12.31
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Abstract

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

Keywords

References

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