Microstructure and thermal conductivity of AIN ceramics with ${Y_2}{O_3}$ fabricated by pressureless sintering

상압 소결법으로 제조된 이트리아 첨가 질화 알루미늄 세라믹스의 미세 구조 및 열전도도

  • Published : 2009.02.28

Abstract

The effect of ${Y_2}{O_3}$ as a sintering additive on thermal conductivity and microstructure of pressureless sintered AIN ceramics was investigated at sintering temperature range from 1,700 to $1,900^{\circ}C$. ${Y_2}{O_3}$ added AIN specimens showed higher densification rate than pure AIN because of the formation of the yttrium aluminates secondary phase by reaction of ${Y_2}{O_3}$ and ${Al_2}{O_3}$ of AIN surface. The thermal conductivity of AIN specimens was promoted by the addition of ${Y_2}{O_3}$ in spite of the formation of secondary phase in AIN gram boundaries and grain boundary triple junction, because ${Y_2}{O_3}$ addition could reduced the oxygen contents in AIN lattice which is primary factor of thermal conductivity. The them1al conductivity of AIN specimens was promoted by increasing sintering time because the increases of average grain size and the elimination of secondary phases from the grain boundary due to the evaporation. Particularly. the thermal conductivity of AIN specimen sintered at $1,900^{\circ}C$ for 5 hours improved over 20 %. $141\;Wm^{-1}K^{-1}$, compared with the specimen sintered at $1,900^{\circ}C$ for 1 hour.

AIN 소결에 있어서 ${Y_2}{O_3}$를 소결 조제로하여 $1,700{\sim}1,900^{\circ}C$의 온도에서 상압소결하엿을 때 ${Y_2}{O_3}$ 첨가와 소결 유지 시간이 소결 특성, 미세 구조 및 열전도도에 미치는 영향에 관하여 평가하였다. ${Y_2}{O_3}$의 첨가에 따라 AIN 시편은 치밀화가 증진되고 열전도도가 증가됨을 확인할 수 있었다. 이러한 결과는 AIN 분말 표면의 ${Al_2}{O_3}$${Y_2}{O_3}$의 반응으로 형성된 이차상에 기인한 것으로, 첨가된 ${Y_2}{O_3}$${Al_2}{O_3}$와의 반응으로 치밀화에 기여를 하여 고온에서 액상의 형성으로 급속히 치밀화를 증진시키며, AIN 결정격자 내부로 유입될 수 있는 산소의 양을 감소시킴으로써 AIN 시편의 열전도도를 증가시키는 것을 알 수 있었다. 또한 소결시간의 증가에 따라 열전도도는 급격히 증가하였는데 이는 결정립계의 이차상이 고온에서 휘발되어 그 양이 감소함에 기인하는 것으로 파악되었다. $1,900^{\circ}C$ 5시간 소결한 시편의 열전도도는 약 $141\;Wm^{-1}K^{-1}$ 값을 나타내었고 이는 1시간 소결한 시편과 비교하여 20% 이상 증가된 값이었다.

Keywords

References

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