한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

한국정밀공학회 (Korean Society for Precision Engineering)
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레이저를 이용한 TSV 드릴링 공정

Fabrication of Through Silicon Via using Laser Drilling Process

  • 신동식 (한국기계연구원 광응용생산기계연구실) ;
  • 서정 (한국기계연구원 광응용생산기계연구실) ;
  • 이제훈 (한국기계연구원 광응용생산기계연구실) ;
  • 김경한 (한국기계연구원 광응용생산기계연구실)
  • Shin, Dong-Sig (Department of High Density Energy Beam Processing & System, KIMM) ;
  • Suh, Jeong (Department of High Density Energy Beam Processing & System, KIMM) ;
  • Lee, Jae-Hoon (Department of High Density Energy Beam Processing & System, KIMM) ;
  • Kim, Kyung-Han (Department of High Density Energy Beam Processing & System, KIMM)
  • 발행 : 2009.12.01
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초록

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참고문헌

  1. Emc3d consortium, http://www.EMC3D.org
  2. Yole development, http://www.yole.fr
  3. Alcatel Micro Machining Systems, http://www.alcatelmicromachining.com
  4. Xsil, http://www.xsil.com
  5. Lee, J., Sohn, H., Kim, J. and Shin, D., "Advanced Laser Micromachining Technology," J. of the KSPE, Vol. 23, No.1, pp. 13-22, 2006
  6. Coherent Inc, http://www.coherent.com
  7. Duley, "UV Lasers: effects and applications in materials science," Cambridge, pp. 148-199, 1996
  8. Shin, D., Suh, J. and Lee, J., "Fabrication of Through Silicon Via using Hybrid process," Korea Patent No. 0103681, 2009