TSV를 이용한 3D 패키징 공정 및 장비 기술

3D Packaging Process using TSV and Bonding Machine Technology

  • Song, Jun-Yeob (Department of Ultra Precision Machines and Systems, KIMM) ;
  • Lee, Jae-Hak (Department of Ultra Precision Machines and Systems, KIMM) ;
  • Ha, Tae-Ho (Department of Ultra Precision Machines and Systems, KIMM) ;
  • Lee, Chang-Woo (Department of Ultra Precision Machines and Systems, KIMM) ;
  • Yoo, Choong-Don (Department of Mechanical Engineering, KAIST)
  • 발행 : 2009.12.01

초록

키워드

참고문헌

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  6. Dragoi, V., Alexe, M., Hamacher, M. and Heidrich, H., "Microring resonators fabrication by BCB adhesive wafer bonding," Semiconductor Wafer Bonding 10: Science, Technology and Applications Proceedings, pp. 106-115, 2008
  7. Schjolberg-Henriksen, K., Moe, S., Taklo, M. M. V., Storas, P. and Ulvensoen, J. H., "Low-temperature plasma activated bonding for a variable optical attenuator," Sensors and Actuators A, Vol. 142, No.1, pp. 413-420, 2008 https://doi.org/10.1016/j.sna.2007.02.020
  8. Tong, Q.-Y. and G$\ddot{o}$sele, U., "Semiconductor wafer bonding: science and technology," John Willy & Sons, Inc., 1998
  9. Matthias, T., Wimplinger, M., Pargfrieder, S. and Lindner, P., "3D process integration: wafer-to-wafer and chip-to-wafer bonding," MRS Fall Meeting 2006 (Symposium Y: Enabling Technologies for 3-D Integration), 2006