참고문헌
- J.U. Knickerbocker, C.S. Patel, P.S. Andry, C.K. Tsang, L.P. Buchwalter, E.J. Sprogis, H. Gan, R.R. Horton, R.J. Polastre, S.L. Wright and J.M. Cotte, "3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias," IEEE Journal of Solid-State Circuits, vol. 41, no. 8, pp. 1718-1725, 2006. https://doi.org/10.1109/JSSC.2006.877252
- A. Zolfaghari, A. Chan, and B. Razavi, "Stacked Inductors and Transformers in CMOS Technology," IEEE Journal of Solid-State Circuits, vol. 36, no. 4, pp. 620-628, 2001. https://doi.org/10.1109/4.913740
- H.C. Bae, S.H. Kim, J.Y.Lee, J.Y.Kang, S.H. Lee and H.K. Yu, "Cost Effective Parallel-branch Spiral Inductor with Enhanced Quality Factor and Resonance Frequency," Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), pp. 87-90, Jan. 2007.
- A. Sutono, D.H. Heo, Y.J.E.Chen and J. Laskar, "High-Q LTCC-Based Passive Library for Wireless System-on-Package (SOP) Module Development," IEEE Trans.on Microwave Theory and Techniques, vol. 49, no. 10, pp. 1715-1724, 2001. https://doi.org/10.1109/22.954775
- S.C. Choi, J.E. Youm, K. Heo, J.H. Lim, C.S. Park and S.W. Hwang, "LTCC Bandpass Filter using 3D coupled Helical Inductors," Microwave and Optical Technology Letters, vol. 49, no. 5, pp. 1146-1147, 2007. https://doi.org/10.1002/mop.22366
- Y.J.E. Chen, M. Hamai, D. Heo, A. Sutono, S. Yoo and J. Laskar, "RF Power Amplifier Integration in CMOS Technology," IEEE MTT-S Digest, pp. 545-548, 2000.
- I.K. Ju, I.B. Yom, H.S. Lee and S.H. Oh, "High Performance Vertical Transition form DC to 70GHz for System-on-Package Applications", Proceedings of the 38th European Microwave Conference, pp. 1338-1341, 2008
- K.C. Eun and C. S. Park, "Air Cavity Incorporation to LTCC Spiral Inductor for High Q-factor and SRF,” International Journal of Electronics and Communications, vol. 58, no. 6, pp. 434-436, 2004. https://doi.org/10.1078/1434-8411-54100267
- C.P. Yue and S.S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF ICs," IEEE Journal of Solid-State Circuits, vol. 33, pp. 743-752, 1998. https://doi.org/10.1109/4.668989