마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제15권3호
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- Pages.1-8
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
환원분위기 열처리가 $(Bi,Sb)_{2}Te_{3}$ 증착박막의 열전특성에 미치는 영향
Efface of Annealing in a Reduction Ambient on Thermoelectric Properties of the $(Bi,Sb)_{2}Te_{3}$ Thin Films Processed by Vacuum Evaporation
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Kim, Min-Young
(Department of Materials Science and Engineering, Hongik University) ;
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Oh, Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2008.09.30
초록
환원분위기 열처리가 진공증착법으로 형성한
Effects of annealing process in a reduction ambient on thermoelectric properties of the