참고문헌
- W.-Y. Chen, Sandeep, K., Gupta, and Melvin, A. Breuer, "Analytical models for crosstalk excitation and propagation in VLSI Circuits", IEEE, Vol. 21, No. 10, p. 1117, 2002
- Mikhanil, R., Baklanov, M. R., and Maex., K., "Porous low dielectric constant materials for microelectronics", Phil. Trans. R. Soc., Vol. 364, p. 201, 2006 https://doi.org/10.1098/rsta.2005.1679
- Maex K., Baklanov M. R., Shamiryan D., Iacopi F., Brongersma S. H., and Yanovitskaya Z. S., "Low dielectric constant materials for microelectronics", Applied Physics Review, Vol. 93, p. 8793, 2003 https://doi.org/10.1063/1.1567460
- Y.-H. Kim, M. S. Hwang, and H. J. Kim, "Infrared spectroscopy study of low- dielectric-constant fluorine-incorporated and carbon-incorporated silicon oxide films", J. of Applied Physics, Vol. 90, p. 3367, 2001 https://doi.org/10.1063/1.1402152
- Y.-H. Kim, S.-K. Lee, and H. J. Kim, "Low-k Si-O-C-H composite films prepared by plasma-enhanced chemical vapor deposition using bistrimethylsilymethane precursor", J. Vac. Sci. Tech. A, Vol. 18(4), Part 2, p. 1216, 2000
- Y.-H. Kim, "Deposition and characterization of low-dielectric-constant SiOCH thin films for interlayer dielectrics of multilevel interconnection", Ph.D. Dissertation, Seoul National University, 2002
-
Nara, A. and Itoh, H., "Low dielectric constant insulator formed by downstream plasma CVD at room temperature using
$TMS/O_2$ ", Jpn. J. Appl. Phys., Vol. 36, p. 1477, 1997 https://doi.org/10.1143/JJAP.36.1477 - Grill, A. and Patel, V., "Low dielectric constant SiCOH films as potential cadidates for interconnect dielectrics", Mat. Res. Soc. Symp. Proc., Vol. 565, p. 107, 1999
- Noda, I., "Generalized two-dimensional correlation method applicable to infrared, raman, and other types of spectroscopy", appl. spectroscopy, Vol. 47, p. 1329, 1993 https://doi.org/10.1366/0003702934067694
- Noda, I., Dowrey, A. E., and Marcott, C., "Recent developments in two-dimensional infrared (2D IR) correlation spectroscopy", Appl. Spectrosc., Vol. 47, p. 1317, 1993 https://doi.org/10.1366/0003702934067513
- Y.-O. Kim, Y. M. Jung, S. B. Kim, and S.-M. Park, "Two-dimensional correlation analysisof spectroelectrochemical data for p-Benzoquinone reduction in acetonitrile", Anal. Chem., Vol. 76, No. 17, p. 5236, 2004 https://doi.org/10.1021/ac049587g
- S.-Y. Jing, H.-J. Lee, and C. K. Choi, "Chemical bond structure on Si-O-C composite films with a low dielectric constant deposited by using inductively coupled plasma chemical vapor deposition", J. of Korean Physical Society, Vol. 41, p. 769, 2002
-
Oh, T., Kim, H. S., Oh, S. B., and Won, M. S., "Chemical shift determined according to flow rate ration
$O_2$ . BTMSM by fourier transform infrared spectra and x-ray photoelectron spectroscopy", Jpn. J. Appl. Phys., Vol. 42, p. 6292, 2003 https://doi.org/10.1143/JJAP.42.6292 - T. Oh and H. B. Kim, "Properties of organic thin-flim transistors on hybrid-type interlayer dielectric materials", J. of Korean Physical Society, Vol. 49, p. 865, 2005
- Grill, A., Perraud, L., Patel, V., Jahnes, C., and Cohen, S., "Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition", Applied Physics letters, Vol. 79, p. 803, 2001 https://doi.org/10.1063/1.1392976
- C. S. Yang, Y. H. Yu, K.-M. Lee, H.-J. Lee, and C. K. Choi, "Investigation of low dielectric carbon-doped silicon oxide films prepared by PECVD using methyltrimethoxysilane precursor", Thin Solid Films, Vol. 50, p. 506, 2006
- J. Xu, C. S. Yang, and C. K. Choi, "Annealing effects on the structural and electrical properties of SiOC(-H) films with low dielectric constant prepared by plasma- enhanced chemical vapor deposition", J. of Korean Physical Society, Vol. 45, p. 175, 2003
- A. Grill, "Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-k to extreme low-k interconnect materials", J. of Applied Physics, Vol. 93, p. 1785, 2003 https://doi.org/10.1063/1.1534628
-
J. W. Kim, C. S. Hwang, H. B. Kim, "Properties of SiOCH thin film bonding mode by BTMSM/
$O_2$ flow rates", J. of KIEEME(in Korean), Vol. 21, No. 4, p. 354, 2008 https://doi.org/10.4313/JKEM.2008.21.4.354
피인용 문헌
- An Inspection of Stability for Annealing SiOCH Thin Flim vol.22, pp.1, 2009, https://doi.org/10.4313/JKEM.2009.22.1.041