217Plus^TM을 통한 전자 부품들의 고장률 산출

Failure Rates of Electronic Parts through 217Plus^TM

Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.