Structural Engineering and Mechanics

  • 제29권4호
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  • Pages.423-431
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  • 2008
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  • 1225-4568(pISSN)
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  • 1598-6217(eISSN)
테크노프레스 (Techno-Press)
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DOI QR코드

DOI QR Code

Numerical simulation of relation between interface topography and residual stress in thermal barrier coatings

  • Yao, Guo-Feng (College of Mechanical Science and Engineering, Nanling Campus, Jilin University) ;
  • Ma, Hong-Mei (College of Mechanical Science and Engineering, Nanling Campus, Jilin University) ;
  • Zhang, Lin-Wen (Jilin College of Traffic Profession Technique)
  • 투고 : 2005.09.15
  • 심사 : 2007.02.20
  • 발행 : 2008.07.10
⟨ 이전 논문 다음 논문 ⟩

초록

With respect to thermal barrier coating, the analysis of interface cohesion and residual stress is important to the life of TBC from mechanical view point. Up to now, there is not a model of describing interface cohesion. In the paper, we give a simple model of computing residual stress and study the residual stress of TBC with ANSYS. The distribution of the residual stress in different interface topography and the relationship between the residual stress and the interface topography dimension are presented.

키워드

참고문헌

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