References
- J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean)
- Japan Marketing Survey Co. Ltd.: PCB World Market Data (2006) (in Japanese)
- J.M. Koo, J.W. Kim, J.W. Yoon, B.I. Noh, C.Y. Lee, J.H. Moon, C.D. Yoo and S.B. Jung: Ultrasonic Bonding Technology for Flip Chip Packaging, Journal of KWS, 26-1 (2008), 31-36 (in Korean) https://doi.org/10.5781/KWJS.2008.26.1.031
- 한국산업기술지원센터: 잉크젯 및 나노임프린팅 기술 (2007.03) (in Korean)
- B.I. Noh and S.B. Jung: J. Mater. Sci. Electron, In-Press
- B.I. Noh, J.B. Lee and S.B. Jung: Microelectron. Reliab., 48 (2008) 652-656 https://doi.org/10.1016/j.microrel.2007.09.006
- W.S. Hong, S.B. Jung and K.B. Kim: Analysis Method of Metallic Ion Migration, Journal of KWS, 23-2 (2005), 22-30 (in Korean)
- JEDEC Starndard: JESD22-A101B
- JEDEC Standard: JESD22-A102C
- JEDEC Standard: JESD22-A110B
- 박정원, 천성일: 국내외 신뢰성 기술 및 산업 동향, 전자정보센터 (http://www.eic.re.kr) (2005. 12.) (in Korean)
- Katsuaki Suganuma: Ink-Jet Wiring of Fine Pitch Circuits with Metallic Nano Particle Pastes, CMC Publisher (2006) (in Japanese)