참고문헌
- 瀨之口宏三, 'エレクトロニクスを支える接着技術',(株)東レリ サ-チセンタ-
- 菅沼克昭 編著, ここまできた 導電性接着劑技術, 工業調査會
- 小日向荗.石川治男.志賀大樹.大山千鶴子, '導電性接着劑'日本接着學會誌, 38, No.12 (2003)
- 高橋文明,"ACカロリメトリ法", 熱物性學會誌,15, No.2
- 長谷川喜一.門多仗治.小日向荗."ベンゾオキサジン化合物を硬化劑としたエポシ樹脂の傳導性接着劑への應用
- T.Kimura, T.Nakai, H. Ishikawa, K. Oosawa, S.Kohinata, Thermal conductivity and RF Signal Transmission of Ag-Filled Epoxy Resin: 53rd Electronic, Components & Technology Conference, P.1383-1390 (2003)
- 김태현 'RFID용 전도성잉크' 고분자과학과 기술 19-1, P.35-39 (2008)
- 井口秦孝.阿座上竹四.萬谷志郞.菊地淳.杉本克久.山村力, 材料電子化學,金屬化學入門シリズ4
- M. Nakamoto, Y. Yamamoto, M. Fukusumi, J. Chem. Soc., Chem. Commum., 1622(2002)
- 本多俊之,'新し塗膜形成機構 低溫硬化․高導電材料',電子材料, P.97-101 (2003)
- Y. Sun, Y. Xia, 'Large Scale synthesis of Uniform Silver Nanowires Through a Soft Self-Seeding:, Polyprocess:Advanced Materials, 14, No.11, P833- 837 (2002) https://doi.org/10.1002/1521-4095(20020605)14:11<833::AID-ADMA833>3.0.CO;2-K
- T.Bohler, J.Grebing, A.Mayer, H.Lohnysen, 'Mechanically controllable break-junction for use as electrode for molecular electronics', Nanotechnology 15, P.465-471(2005) https://doi.org/10.1088/0957-4484/15/7/054