마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제15권1호
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- Pages.45-50
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
구리 Through Via 전해연마에 미치는 첨가제의 영향 연구
The Effects of Additives on the Electropolishing of Copper Through Via
- Lee, Suk-Ei (Department of Materials Science and Engineering, Hongik University) ;
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Lee, Jae-Ho
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2008.03.30
초록
Through via 3D SiP의 평탄화 공정에 적용하기 위해 전기도금법을 이용하여 직경
The effects of electrolytes and additives on the electropolishing of 50 and