마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제15권1호
- /
- Pages.33-37
- /
- 2008
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구
A Study of Kirkendall Void Formation and Impact Reliability at the Electroplated Cu/Sn-3.5Ag Solder Joint
- Kim, Jong-Yeon (Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
- Yu, Jin (Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology)
- 발행 : 2008.03.30
초록
Kirkendall void는 전해도금 Cu/Sn-Ag 솔더 접합부에서 형성되었으며 Cu 도금욕에 함유되는 첨가제에 의존한다. 첨가제로 사용된 SPS의 함량의 증가와 함께
A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the