펨토초 레이저 어블레이션을 이용한 알루미나 세라믹 기판의 정밀 마이크로 드릴링

Precision microdrilling of alumina ceramic substrates by femtosecond laser ablation

  • 김성훈 (광주과학기술원, 고등광기술연구소) ;
  • 손익부 (광주과학기술원, 고등광기술연구소) ;
  • 노영철 (광주과학기술원, 고등광기술연구소) ;
  • 이종민 (광주과학기술원, 고등광기술연구소) ;
  • 정성호 (광주과학기술원, 고등광기술연구소)
  • 발행 : 2008.03.31

초록

The characteristics of femtosecond laser ablation of $Al_2O_3$ for prescision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with $sub-100{\mu}m$ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 kHz, wavelength 785 nm, pulse duration 185 fs)

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