Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives

이방성 도전성 접착제를 이용한 고밀도 전자 패키징 기술

  • Published : 2008.02.28
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References

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