Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 4
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- Pages.51-57
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Wettability Evaluation of Sn-0.3Ag-0.7Cu Solder Alloy with Different Flux Activity and Indium Addition
플럭스 활성도 및 In 첨가에 따른 Sn-0.3Ag-0.7Cu 솔더 조성의 젖음 특성 변화
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Yu, A-Mi
(Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology(KITECH)) ;
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Kim, Jun-Ki
(Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology(KITECH)) ;
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Kim, Mok-Soon
(School of Materials Science & Engineering, Inha University) ;
- Hyun, Chang-Yong (Department of Materials Science & Engineering, Seoul National University of Technology) ;
- Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Technology)
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유아미
(한국생산기술연구원 용접.접합연구부/Microjoining Center) ;
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김준기
(한국생산기술연구원 용접.접합연구부/Microjoining Center) ;
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김목순
(인하대학교 신소재공학부) ;
- 현창용 (서울산업대학교 신소재공학과) ;
- 이종현 (서울산업대학교 신소재공학과)
- Published : 2008.12.31
Abstract
In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of
저 Ag 함유 Sn-Ag-Cu계 무연솔더 조성, 즉, Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금 조성의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 특성을 시차주사열량계(differential scanning calorimeter, DSC)로 측정하고, 인장시험을 통한 응력-변형률 곡선을 관찰하였다. 아울러 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상시키기 위해 halide의 함유량이 많은 플럭스(flux)를 적용하거나 Sn-0.3Ag-0.7Cu 조성에 0.2wt.%의 In을 첨가하여 그 젖음 특성의 개선 정도를 분석해 보았다. 그 결과 halide 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우가