Journal of Welding and Joining
- Volume 26 Issue 5
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- Pages.43-48
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- 2008
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- 2466-2232(pISSN)
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- 2466-2100(eISSN)
DOI QR Code
Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder
Sn-1.7Bi-0.7Cu-0.6In 솔더의 특성 연구
- Park, Ji-Ho (Dept. of Mater. Sci. & Eng., University of Seoul) ;
- Lee, Hee-Yul (Dept. of Mater. Sci. & Eng., University of Seoul) ;
- Jhun, Ji-Heon (Dept. of Mater. Sci. & Eng., University of Seoul) ;
- Cheon, Chu-Seon (Danyangsoltec) ;
- Jung, Jae-Pil (Dept. of Mater. Sci. & Eng., University of Seoul)
- 박지호 (서울시립대학교 신소재공학과) ;
- 이희열 (서울시립대학교 신소재공학과) ;
- 전지헌 (서울시립대학교 신소재공학과) ;
- 전주선 ((주)단양 솔텍) ;
- 정재필 (서울시립대학교 신소재공학과)
- Published : 2008.10.31
Abstract
Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at
Keywords
- lead-free solder;
- Sn-1.7%Bi-0.7%Cu-0.6%In;
- Sn-3.5%Ag-0.7%Cu;
- solder characteristics;
- wetting property