전자공학회논문지 IE

The Institute of Electronics and Information Engineers (대한전자공학회)
권호 표지

A Study on identification and improvement of adhesive quality using adhesive theory at micro/nano scale contact

응착이론을 이용한 마이크로/나노스케일 접촉에서의 응착특성 규명 및 개선에 관한 연구

  • Kim, Gyu-Sung (Department of Autimobile, Seoil College) ;
  • Yoon, Jun-Ho (Department of Autimobile, Yeojoo Institute of Technology)
  • Published : 2007.09.25
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Abstract

In this paper, elastic and plastic adhesion index was very important in deciding adhesive characteristics and varying elastic and plastic index, dimensionless load and pull-off force were analyzed and simulated. Finally, using AFM, experimental surface roughness parameters of substrates and pull-off force between tip and substrates were produced. Using these values, pull-off forces were calculated and were compared with experimental pull-off forces. Through simulation and experiment, it was found that interaction of asperity also had very important influence on adhesive contact.

거칠기를 고려한 응착모델들에 있어서 탄성 응착 지수와 소성 응착 지수가 중요한 매개변수이며, 본 논문에서는 매개 변수를 변화시켜 무차원화 된 하중과 분리힘의 특성을 시뮬레이션 하고 분석하였다. AFM을 이용하여 실험 샘플의 표면 거칠기 관련 특성 값들을 얻었으며, 이를 이용하여 상호작용을 고려한 경우와 고려하지 않은 경우의 분리힘을 계산하였다. 계산된 분리힘들을 팁과 샘플 표면 사이의 측정된 분리힘과 비교하였고, 이를 통하여 표면 거칠기 돌기의 상호작용으로 인한 변형이 응착 특성에 중요한 영향을 미치는 인자임을 알 수 있었다.

Keywords

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