Phenoxy를 이용한 비상용성 폴리아미드 6/폴리부틸렌테레프탈레이트 블렌드의 상용화

Compatibilization of Immiscible Polyamide 6 and Poly(butylene terephthalate) Blend Using Poly(hydroxy ether of bisphenol A)

  • 박승빈 (전남대학교 응용화학공학부 기능성 나노 신화학소재 사업단) ;
  • 김진봉 (전남대학교 응용화학공학부 기능성 나노 신화학소재 사업단) ;
  • 이무성 (전남대학교 응용화학공학부 기능성 나노 신화학소재 사업단)
  • Park, Seung-Bin (Division of Applied Chemical Engineering, Chonnam National University) ;
  • Kim, Jin-Bong (Division of Applied Chemical Engineering, Chonnam National University) ;
  • Lee, Moo-Sung (Division of Applied Chemical Engineering, Chonnam National University)
  • 발행 : 2007.08.30

초록

In this study, we investigated the compatibilizing effect of poly(hydroxy ether of bisphenol A) (phenoxy) on the immiscible blends of polyamide 6 (PA6) and poly(butylene terephthalate) (PBT). From scanning electron micrographs of PBT/PA6/phenoxy ternary blends, it was found that phenoxy forms encapsulating layer between PA6 and PBT during melt mixing. However, phenoxy does not contribute to reduce the domain size of dispersed phases, even though the encapsulating morphology results from the reduction in interfacial energy by spreading of phenoxy at the interface of PBT and PA6. The storage moduli of PBT/PA6/phenoxy blends slightly increase with phenoxy content below $T_g$ of phenoxy, but the situation is reversed above $T_g$ of phenoxy, indicating that the mechanical properties of polymer blends with encapsulating morphology depend on those of encapsulating polymers. Phenoxy added to PBT/PA6 blends does not significantly improve the tensile, bending, and impact properties of the blends, which calls into question the effectiveness of phenoxy as practical compatibilizers.

키워드

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