DOI QR코드

DOI QR Code

고온용 MEMS 재료의 마이크로 파괴거동에 관한 연구

A Study on the Micro-fracture Behavior of the MEMS Material at Elevated Temperature

  • 발행 : 2007.05.01

초록

The effective fracture toughness testing of materials intended for application in Micro Electro Mechanical Systems (MEMS) devices is required in order to improve understanding of how micro sized material used in device may be expected to perform upon the micro scale. ${\gamma}$-TiAl based materials are being considered for application in MEMS devices at elevated temperatures. Especially, in Alloy 4, both ${\alpha}_2$ and ${\gamma}$ lamellae were altered markedly in 3,000 h, $700^{\circ}C$ exposure. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. The materials were examined 2 types Alloy 4 on heat exposed specimen($700^{\circ}C$, 3,000 h) and no heat exposed one. Micro sized cantilever beams were prepared mechanical polishing on both side at $25{\sim}30{\mu}m$ and electro final stage polishing to observe lamellar orientation of same colony with EBSD (Electron Backscatter Diffraction Pattern). Through lamellar orientation as inter-lamellae or trans-lamellae, Cantilever beam was fabricated with Focused Ion Beam(FIB). The directional behavior of the lamellar structure was important property in single material, because of the effects of the different processing method and variations in properties according to lamellar orientation. In MEMS application, it is first necessary to have a reliable understanding of the manufacturing methods to be used to produce micro structure.

키워드

참고문헌

  1. 1995, Micro-Machine Center: Micro Machine Revolution (1999) 1-19 Hirano:Plasticity and Processing, pp. 686-692
  2. Kan, S.C., Eng, T.T. H., Sin, S.S. Y. and Wong, G.K. L., 1996, Sesors ans Actuators A pp. 679-683
  3. Hata, S., Sato, K. and Shimokobe, A., 1999, Proc. Pat of the Conference on Device and Process Technology for MEMS and Microelectronics, pp.97-108
  4. McQuay, P.A., 2001, Cast gamma TiAl alloys, Are we There Yet? In Proceedings of Third International Symposium on Structural Intermetallics (ISSI 3), Structural Intermetallics, TMS, Warrendale, USA. 2001
  5. Loria, E.A., 2001, Quo vadis titanium aluminide. Intermetallics, pp.997-1001 https://doi.org/10.1016/S0966-9795(01)00064-4
  6. Ohnuma, I., et al., 2000, Phase Equilibria in the Ti-Al Binary System. Acta material, pp. 3113-3123
  7. Jiang, Z.W., Voice, W. E. and Bowen, P., 2002, Thermal Stability of Ti-46Al-5Nb-1W Alloy, Materials Science and Engineering a, pp.329-331
  8. Adam J. Schwartz (Editor), Mukul Kumar (Editor), Brent L. Adams (Editor), Electron Backscatter Diffraction in Materials Science, pp.1-30
  9. Huang, Z.W., Bowen, P., Davey, S. and Blenkinshop, P.A, 1997, Crystallographic Features of Intralamellar Fracture in a Fully Lamellar Tial Based Alloy https://doi.org/10.1016/S1359-6462(98)00002-5
  10. Higo, Y., Takashima,K., Shimojo, M., Sugiura, S. and Swain, M.V., 2000, New Equipment for Evaluating Performance of Microelements on MEMS, MicroMat pp.997-1000
  11. Halford, T.P., Takashima, K., Higo, Y. and Bowen, P., 2005, Fracture Tests of Micro-sized TiAl Specimens Fatigue and Fracture of Engineering Materials and Structures pp. 695-701
  12. Halford, T.P., 2003, 'Fatigue and Fracture of a High strength, Fully Lamellar g-TiAl base Alloy,' PhD Thesis, The University of Birmingham
  13. Kim, H.Y. and Maruyama, K., 2003, Stability of Lamellar Micorstructure of Hard Orientated PST Crystal of TiAl Alloy
  14. Murakami, S., Yun Hea Kim and Guskawa, H., Strength of Material and Foundation of Fracture, West Japan Laws Publication