한국고분자학회지:고분자과학과기술 (Polymer Science and Technology)
- 제18권6호
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- Pages.542-548
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- 2007
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- 1225-0260(pISSN)
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- 2586-1476(eISSN)
탄소나노튜브의 열적 특성과 이를 이용한 전자패키지용 Thermal Interface Material 개발 동향
Thermal Interface Materials in Electronic packages Using Thermal Conducting Properties of Carbon Nanotubes
- Lee, Jung-Sub (Department of Materials Science and Engineering, KAIST) ;
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Jeon, Duk-Young
(Department of Materials Science and Engineering, KAIST)
- 발행 : 2007.12.26