Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 14 Issue 1
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- Pages.39-47
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- 2007
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Interfacial fracture Energy between Electroless Plated Ni film and Polyimide for Flexible PCB Applications
Flexible PCB용 무전해 도금 Ni 박막/Polyimide 계면파괴에너지 평가
- Min, Kyoung-Jin (School of Material Science and Engineering, Andong National University) ;
- Park, Sung-Cheol (School of Material Science and Engineering, Andong National University) ;
- Lee, Jee-Jeong (Surface Technology Research Center, Korea Institute of Machinery and Materials) ;
- Lee, Kyu-Hwan (Surface Technology Research Center, Korea Institute of Machinery and Materials) ;
- Lee, Gun-Hwan (Surface Technology Research Center, Korea Institute of Machinery and Materials) ;
- Park, Young-Bae (School of Material Science and Engineering, Andong National University)
- 민경진 (안동대학교 신소재공학부) ;
- 박성철 (안동대학교 신소재공학부) ;
- 이지정 (한국기계연구원 표면기술연구센터) ;
- 이규환 (한국기계연구원 표면기술연구센터) ;
- 이건환 (한국기계연구원 표면기술연구센터) ;
- 박영배 (안동대학교 신소재공학부)
- Published : 2007.03.30
Abstract
It is investigated how KOH and Rthylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by
폴리이미드 표면에 대한 습식 개질 전처리 조건에 따른 폴리이미드와 무전해 도금 Ni 박막사이의 계면파괴에너지를