Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 14 Issue 4
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- Pages.21-25
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- 2007
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder
Sn-0.7wt%Cu-Xwt%Re 솔더의 특성에 관한 연구
- Noh, Bo-In (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Won, Sung-Ho (Micro Electronic Packaging Consortium, Sungkyunkwan University) ;
- Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
- Published : 2007.12.30
Abstract
In this study, the properties of Sn-0.7wt%Cu-Xwt%Re(X=
본 연구에서는 시차주사열량법, 젖음성 시험기, 비커스 경도계와 인장 시험기를 이용하여 Sn-0.7wt%Cu-Xwt%Re(X=