Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Study on Wettability of Sn-Xwt%Cu Solder

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구

  • Noh, Bo-In (Graduate School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Yoon, Jeong-Won (Graduate School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Vu, Bui Quoc (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Jung, Seung-Boo (Graduate School of Advanced Materials Science and Engineering, Sungkyunkwan University)
  • 노보인 (성균관대학교 금속재료공학과 대학원) ;
  • 윤정원 (성균관대학교 금속재료공학과 대학원) ;
  • ;
  • 정승부 (성균관대학교 금속재료공학과 대학원)
  • Published : 2007.12.31
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Abstract

The wettability of Sn-Xwt%Cu(X=$0{\sim}3wt%$) solder was evaluated with wetting balance tester. And, the intermetallic compounds(IMCs) which were formed at the interface between solders and pads were investigated by using scanning electron microscopy(SEM) and energy dispersive spectroscopy(EDS). The wetting force of Sn-0.7wt%Cu solder was higher than that of 100wt%Sn and Sn-3.0wt%Cu solder. The value of $\gamma_{fl}$ and ($\gamma_{fs}-\gamma_{ls}$) had a tendency to increase with increasing the wetting temperature. The activation energy with bare Cu pad and flux with 15% solid content was increased in the following order: Sn-0.7Cu (68.42 kJ/mol) ; Sn-3.0Cu(72.66 kJ/mol) ; Sn solder(94.53 kJ/mol). It was identified that the Cu6Sn5 phase was formed at the interface between Sn-Xwt%Cu solder and Cu pad.

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References

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