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Influence of Surface Treatment of Polyimide Film on Adhesion Enhancement between Polyimide and Metal Films

  • Park, Soo-Jin (Department of Chemistry, Inha University) ;
  • Lee, Eun-Jung (Department of Chemistry, Chungbuk National University) ;
  • Kwon, Soo-Han (Department of Chemistry, Chungbuk National University)
  • Published : 2007.02.20

Abstract

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

Keywords

References

  1. Tew, G. N. J. Am. Chem. Soc. 2006, 128, 3104
  2. Khongtong, S.; Ferguson, G. S. J. Am. Chem. Soc. 2002, 124, 7254 https://doi.org/10.1021/ja017396e
  3. Liaw, D.-J.; Chang, F.-C.; Leung, M.; Chou, M.-Y.; Muellen, K. Macromolecules 2005, 38, 4024 https://doi.org/10.1021/ma048559x
  4. Park, S. J.; Kim, H. S.; Jin, F. L. J. Colloid Interface Sci. 2005, 288, 238 https://doi.org/10.1016/j.jcis.2005.02.061
  5. Kim, Y.-H.; Kim, H.-S.; Kwon, S.-K. Macromolecules 2005, 38, 7950 https://doi.org/10.1021/ma047433x
  6. Tummala, R. R.; Rymaszewski, E. J. Microelectronics Packaging Handbook; Van Nostrand Reinhold: New York, U. S. A., 1989; p 54
  7. Ling, Q.-D.; Chang, F.-C.; Song, Y.; Zhu, C.-X.; Liaw, D.-J.; Chan, D. S.-H.; Kang, E.-T.; Neoh, K.-G. J. Am. Chem. Soc. 2006, 128, 8732 https://doi.org/10.1021/ja062489n
  8. Zhang, F.; Jia, Z.; Srinivasan, M. P. Langmuir 2005, 21, 3389 https://doi.org/10.1021/la048741r
  9. Park, S. J.; Cho, K. S.; Kim, S. H. J. Colloid Interface Sci. 2004, 272, 384 https://doi.org/10.1016/j.jcis.2003.12.027
  10. Manzione, T. L. Plastic Packaging of Microelectronic Devices; Van Nostrand Reinhold: New York, U. S. A., 1990; p 87
  11. Murdey, R.; Stuckless, J. T. J. Am. Chem. Soc. 2003, 125, 3995 https://doi.org/10.1021/ja028829w
  12. Honma, M.; Hirata, K.; Nose, T. Appl. Phys. Lett. 2006, 88, 33513 https://doi.org/10.1063/1.2166688
  13. Butoi, C. I.; Steen, M. L.; Peers, J. R. D.; Fisher, E. R. J. Phys. Chem. B 2001, 105, 5957 https://doi.org/10.1021/jp010202x
  14. Helt, J. M.; Drain, C. M.; Bazzan, G. J. Am. Chem. Soc. 2006, 128, 9371 https://doi.org/10.1021/ja056809z
  15. Ramos, M. D. Vaccum 2002, 64, 255 https://doi.org/10.1016/S0042-207X(01)00332-3
  16. Acevado, M.; Harris, F. W. Polymer 1994, 35, 4456 https://doi.org/10.1016/0032-3861(94)90107-4
  17. Thanuja, J.; Srinivasan, M. J. Polym. Sci. Polym. Chem. 1988, 26, 1697 https://doi.org/10.1002/pola.1988.080260702
  18. Park, S. J.; Lee, H. Y. J. Colloid Interface Sci. 2005, 285, 267 https://doi.org/10.1016/j.jcis.2004.11.062
  19. Fowkes, F. M. J. Phys. Chem. 1963, 67, 2538 https://doi.org/10.1021/j100806a008
  20. Park, S. J. Interfacial Forces and Fields: Theory and Applications; Hsu, J. P., Ed.; Marcel Dekker: New York, U. S. A., 1999; p 394
  21. Murakami, T.; Kuroda, S.; Osawa, Z. J. Colloid Interface Sci. 1998, 202, 37 https://doi.org/10.1006/jcis.1997.5386
  22. Shirahata, N.; Hozumi, A. Chem. Mater. 2005, 17, 20 https://doi.org/10.1021/cm0490165

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