References
- Tew, G. N. J. Am. Chem. Soc. 2006, 128, 3104
- Khongtong, S.; Ferguson, G. S. J. Am. Chem. Soc. 2002, 124, 7254 https://doi.org/10.1021/ja017396e
- Liaw, D.-J.; Chang, F.-C.; Leung, M.; Chou, M.-Y.; Muellen, K. Macromolecules 2005, 38, 4024 https://doi.org/10.1021/ma048559x
- Park, S. J.; Kim, H. S.; Jin, F. L. J. Colloid Interface Sci. 2005, 288, 238 https://doi.org/10.1016/j.jcis.2005.02.061
- Kim, Y.-H.; Kim, H.-S.; Kwon, S.-K. Macromolecules 2005, 38, 7950 https://doi.org/10.1021/ma047433x
- Tummala, R. R.; Rymaszewski, E. J. Microelectronics Packaging Handbook; Van Nostrand Reinhold: New York, U. S. A., 1989; p 54
- Ling, Q.-D.; Chang, F.-C.; Song, Y.; Zhu, C.-X.; Liaw, D.-J.; Chan, D. S.-H.; Kang, E.-T.; Neoh, K.-G. J. Am. Chem. Soc. 2006, 128, 8732 https://doi.org/10.1021/ja062489n
- Zhang, F.; Jia, Z.; Srinivasan, M. P. Langmuir 2005, 21, 3389 https://doi.org/10.1021/la048741r
- Park, S. J.; Cho, K. S.; Kim, S. H. J. Colloid Interface Sci. 2004, 272, 384 https://doi.org/10.1016/j.jcis.2003.12.027
- Manzione, T. L. Plastic Packaging of Microelectronic Devices; Van Nostrand Reinhold: New York, U. S. A., 1990; p 87
- Murdey, R.; Stuckless, J. T. J. Am. Chem. Soc. 2003, 125, 3995 https://doi.org/10.1021/ja028829w
- Honma, M.; Hirata, K.; Nose, T. Appl. Phys. Lett. 2006, 88, 33513 https://doi.org/10.1063/1.2166688
- Butoi, C. I.; Steen, M. L.; Peers, J. R. D.; Fisher, E. R. J. Phys. Chem. B 2001, 105, 5957 https://doi.org/10.1021/jp010202x
- Helt, J. M.; Drain, C. M.; Bazzan, G. J. Am. Chem. Soc. 2006, 128, 9371 https://doi.org/10.1021/ja056809z
- Ramos, M. D. Vaccum 2002, 64, 255 https://doi.org/10.1016/S0042-207X(01)00332-3
- Acevado, M.; Harris, F. W. Polymer 1994, 35, 4456 https://doi.org/10.1016/0032-3861(94)90107-4
- Thanuja, J.; Srinivasan, M. J. Polym. Sci. Polym. Chem. 1988, 26, 1697 https://doi.org/10.1002/pola.1988.080260702
- Park, S. J.; Lee, H. Y. J. Colloid Interface Sci. 2005, 285, 267 https://doi.org/10.1016/j.jcis.2004.11.062
- Fowkes, F. M. J. Phys. Chem. 1963, 67, 2538 https://doi.org/10.1021/j100806a008
- Park, S. J. Interfacial Forces and Fields: Theory and Applications; Hsu, J. P., Ed.; Marcel Dekker: New York, U. S. A., 1999; p 394
- Murakami, T.; Kuroda, S.; Osawa, Z. J. Colloid Interface Sci. 1998, 202, 37 https://doi.org/10.1006/jcis.1997.5386
- Shirahata, N.; Hozumi, A. Chem. Mater. 2005, 17, 20 https://doi.org/10.1021/cm0490165
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