DOI QR코드

DOI QR Code

스테레오 비젼을 이용한 BGA 소자의 볼 높이 측정 알고리즘에 관한 연구

A study on the Measurement Algorithm for the Ball Height of BGA Device Using Stereo Vision

  • 김준식 (호서대학교 전자공학과) ;
  • 박영순 ((주)에버테크노 종합연구소)
  • 발행 : 2006.07.31

초록

본 논문에서는 고 해상도의 CCD카메라를 이용하여 정밀 소자인 BGA(Ball Grid Array)의 2차원 영상을 얻어 BGA소자의 볼 높이 결함을 검출하기 위한 스테레오 영상 모델링 기법에 관하여 연구하고 결함 검출 알고리즘을 제안한다. 논문에서 BGA 소자의 패키지/볼 영역 검출 알고리즘, FOV 조정(calibration), 정점 정합 알고리즘과 높이 측정 방법을 제안한다. 각각의 BGA소자의 결함에 따른 검출 방법을 제안하고 실험을 통해서 성능을 검증하였다.

In this paper, We proposed he algorithm for defect extraction and a study of the stereo image modeling o inspect defect for the ball height of BGA(ball grid way) device using 2-dimensional images captured by the BGA device of using the high resolution CCD cameras. This paper propose the package/ball area extraction of BGA device part, the FOV(field of view) calibration part, the top point matching part, and ball height measurement method. Each BGA device propose extraction method by defect, Through the experiment, we verified the result.

키워드

참고문헌

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피인용 문헌

  1. 3D Accuracy Enhancement of BGA Shiny Round Ball Using Optical Triangulation Method vol.32, pp.9, 2015, https://doi.org/10.7736/KSPE.2015.32.9.799