Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Effects of Polymer Adsorption on Stabilities and CMP Performance of Ceria Abrasive Particles

  • Shimono Norifumi (Department of Chemistry for Materials, Faculty of Engineering, Mie University) ;
  • Kawaguchi Masami (Department of Chemistry for Materials, Faculty of Engineering, Mie University) ;
  • Koyama Naoyuki (Electronic Materials R&D Center, Hitachi Chemical Co., Ltd.)
  • Published : 2006.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper we present that the effects of polymer adsorption on stabilities and CMP performance of ceria abrasive particles. Characterization of ceria abrasive particles in the presence of poly(vinyl pyrrolidone) (PVP) was performed by the measurements of adsorbed amounts of PVP, average sizes, and the back scattering intensities of the ceria abrasive particles as functions of PVP molecular weight and PVP concentration. The ceria abrasive particles in the presence of PVP were used to polish $SiO_2\;and\;Si_3N_4$ films deposited on Si wafers in order to understand the effect of PVP adsorption on chemical mechanical polishing (CMP) performance, together with ceria abrasive particles without PVP. Adsorption of PVP on the ceria abrasive particles enhanced the stability of ceria abrasive particles due to steric stabilization of the thick adsorbed layer of PVP. Removal rates of the deposited $SiO_2\;and\;Si_3N_4$ films by the ceria abrasive particles in the presence of PVP were much lower than those in the absence of PVP and their magnitudes were decreased with an increase in the concentration of free PVP chains in the dispersion media. This suggests that the CMP performance in the presence of PVP could be mainly controlled by the hydrodynamic interactions between the adsorbed PVP chains and the free ones. Moreover, the molecular weight dependence of PVP on the removal rates of the deposited films was hardly observed. On the other hand, high removal rate selectivity between the deposited films in the presence of PVP was not observed.

Keywords

References

  1. L. M. Cook, 'Chemical processes in glass polishing', J. Non-Cryst. Solids, Vol. 120, p. 152, 1990 https://doi.org/10.1016/0022-3093(90)90200-6
  2. Y. Tateyama, T. Hirano, T. Ono, N. Miyashita, and T. Yoda, 'Study on ceria-based slurry for STI planarization', Proc. Int. Symp. Chemical Mechanical Planarization IV, Phoenix, 2000(Electro-chemical Society, Pennington, 2000), p. 297, 2000
  3. T. Katoh, H.-G. Kang, U. Paik, and J.-G. Park, 'Effects of abrasive morphology and surfactant concentration on polishing rate of ceria slurry', Jpn. J. Appl. Phys., Vol. 42, No. 3, p. 1150, 2003 https://doi.org/10.1143/JJAP.42.1150
  4. L.-G. Park, T. Katoh, W. M. Lee, H. Jeon, and U. Paik, 'Surfactant effect on oxide-to-nitride removal selectivity of nano-abrasive ceria slurry for chemical mechanical polishing', Jpn. J. Appl. Phys., Vol. 42, No. 9A, p. 2163, 2003 https://doi.org/10.1143/JJAP.42.2163
  5. S. K. Kim, S. Lee, U. Paik, T. Katoh, and J.-G. Park 'Influence of the electrokinetic behaviors of abrasive ceria particles and the deposited plasmaenhanced tetraethylorthosilicate and chemically vapor deposited $Si_3N_4$ films in an aqueous medium on chemical mechanical planalization for shallow trench isolation', J. Mater. Res., Vol. 18, No. 9, p. 2163, 2003 https://doi.org/10.1557/JMR.2003.0302
  6. H.-G. Kang, T. Katoh, M.-Y. Lee, H.-S. Park, U. Paik, and J.-G. Park, 'Effect of molecular weight of surfactant in nano ceria slurry on shallow trench isolation chemical mechanical polishing (CMP)', Jpn. J. Appl. Phys., Vol. 43, No. 8B, p. L1060, 2004 https://doi.org/10.1143/JJAP.43.L1060
  7. H.-G. Kang, T. Katoh, H.-S. Park, U. Paik, and J.-G. Park, 'Effects of abrasive size and surfactant concentration on the non-prestonian behavior of ceria slurry in shallow trench isolation chemical mechnical polishing', Jpn. J. Appl. Phys., Vol. 44, No. 4, p. L136, 2005 https://doi.org/10.1143/JJAP.44.L136
  8. O. Mengural, G. Meunier, I. Cayre, K. Puech, and P. Snabe, 'Characterization of instability of concentrated dispersions by a new optical analyzer: the TURBISCAN MA 1000', Colloids Surfaces A: Physicochem. Eng. Aspects, Vol. 152, p. 111, 1999 https://doi.org/10.1016/S0927-7757(98)00680-3
  9. L. A. De Faria and S. Trasatti, 'The point of zero charge of $CeO_2$', J. Colloid Interface Sci., Vol. 167, p. 352, 1994 https://doi.org/10.1006/jcis.1994.1370
  10. G. J. Fleer, M. A. Cohen Stuart, J. M. H. M. Scheutjens, T. Cosgrove, and B. Vincent, 'Polymers at Interfaces', Chapman & Hall, London, p. 234, 1993
  11. M. Kawaguchi, I. Hayashi, and A. Takahashi, 'Monolayer studies on adsorbed layer thickness of polyvinylpyrrolidone on polystyrene latices and steric stabilization free energy', Polymer J., Vol. 13. No. 8, p. 783, 1981 https://doi.org/10.1295/polymj.13.783
  12. M. A. Cohen Stuart, G. J. Fleer, and B. H. Bijsterbosch, 'The adsorption of poly(vinyl pyrrolidone) onto silica', J. Colloid Interface Sci., Vol. 90, No. 2, p. 1419, 1982
  13. W. B. Russel, D. A. Saville, and W. R. Schowalter, 'Colloidal Dispersions', Cambridge University Press, Cambridge, p. 194, 1989