References
- Klinger, D. J., Nakada, Y. and Menendez, M. A., 1990, AT&T Reliability Handbook, Von Nostrand Reinhold, New York
- Lenmann, G. L. and Pembroke, J., 1991, Forced convection air cooling or simulated low profile electronic components: Part 1-base case, ASME Journal of Electronic Packing, Vol. 113, pp.21-26 https://doi.org/10.1115/1.2905361
- Moffat, R. J., Arvizu, D. E. and Ortega, A., 1985, Cooling electronic components: forced convection experiments with an air-cooled array, Proceedings of the 23rd National Heat Transfer, HTD-Vol. 48, pp.17-27
- Wirtz, R. A. and Mathur, A., 1994, Convection heat transfer distribution on the surface of an electronic package, ASME Journal of Electronic Packaging, Vol. 116, pp.49-54 https://doi.org/10.1115/1.2905493
- Nakayama, W. and Park, S. H., 1996, Conjugate heat transfer from a single surfacemounted block to forced convective air flow in a channel, ASME Journal of Heat Transfer, Vol. 118, pp.301-309 https://doi.org/10.1115/1.2825845
- Copeland, D., 1992, Effects of channel height and planar spacing on air cooling of electronic components, ASME Journal of Electronic Packaging, Vol. 114, pp.420-424 https://doi.org/10.1115/1.2905475
- Kim, K. S., Kim, W. T. and Lee, K. B., 1998, Cooling characteristics on the forced convection of an array of flat-form electronic components in channel flow, KSME International Journal, Vol. 12, No. 1, pp.132-142 https://doi.org/10.1007/BF02946541
- Kim, K. S. and Yang, J. S., 2006, Cooling characteristics on the forced convection of an array of electronic components in channel flow (I), Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 18, No. 1, pp. 73-80
- Kim, K. S., 1998, Cooling characteristics on the forced convection of an array of electronic components in channel flow, Ph. D. thesis, Pusan National University
- Moffat, R. J. and Anderson, A. M., 1990, Applying heat transfer coefficient data to electronics cooling, ASME Joumal of Heat Transfer, Vol. 112, pp. 882-890 https://doi.org/10.1115/1.2910495
- Kline, S. J. and McClintock, F. A., 1953, Describing uncertainties in vsingle-sample experiments, Mechanical Engineering, Vol. 75, pp. 3-8
- Wirtz, R. A. and, Dykshoorn, P., 1984, Heat transfer from arrays of flat packs in a channel flow, Proceeding of the Fourth-Annual International Electronics Packaging Society, Baltimore, pp.318-326