소성∙가공 (Transactions of Materials Processing)

  • 제15권1호
  • /
  • Pages.76-81
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  • 2006
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  • 1225-696X(pISSN)
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  • 2287-6359(eISSN)
한국소성∙가공학회 (The Korean Society for Technology of Plasticity and materials processing)
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모바일폰 커버의 휨특성 평가를 위한 사출 성형에 관한 연구

A Study on Plastic Injection Molding for Warpage Characteristics Evaluation of Mobile Phone Cover

  • 김옥래 (한국생산기술연구원 정밀금형팀) ;
  • 김무연 (한국생산기술연구원 정밀금형팀) ;
  • 이성희 (한국생산기술연구원 정밀금형팀) ;
  • 권창오 ((주)동아정밀 기술연구소)
  • 발행 : 2006.02.01
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초록

In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.

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참고문헌

  1. B. H. Lee, B. H. Kim, 1997, Variation of Part Wall Thicknesses to Reduce Warpage of Injection Molded Part-Robust Design Against Process Variability, Polymer Plastics Technology & Engineering Journal, Vol.36, No.5, pp. 791-807 https://doi.org/10.1080/03602559708000661
  2. M. C. Huang, C. C. Tai, 2001, The effective factors in the warpage problems of an injected-molded part with a thin shell feature, Journal of Materials Processing Technology, Vol. 110, pp. 1-9 https://doi.org/10.1016/S0924-0136(00)00649-X
  3. S. H. Lee, C. J. Hwang, O. R. Kim, Y. M. Heo, 2004, The Warpage of Orthogonal Stiffened Structures in Injection Molding, PPS Asia/Australia meeting, pp. 45-46
  4. 박성현, 1998, 현대실험계획법, 민영사
  5. 이상복, 2001, 기초부터 현장적용까지 알기쉬운 다구찌법, 상조사