전기도금된 Cu-Sn과 Ni preplated frame의 특성 비교

Comparison of the Characteristics of Cu-Sn and Ni Pre-Plated Frames Prepared by Electro-Plating

  • 이대훈 (선문대학교 전자재료공학과) ;
  • 장태석 (선문대학교 전자재료공학과) ;
  • 홍순성 ((주)아큐텍반도체기술 R&D team) ;
  • 이지원 ((주)아큐텍반도체기술 R&D team) ;
  • 양형우 ((주)아큐텍반도체기술 R&D team) ;
  • 한병근 ((주)아큐텍반도체기술 R&D team)
  • Lee, D.H. (Dept. of Electronic Materials Eng., Sunmoon Univ.) ;
  • Jang, T.S. (Dept. of Electronic Materials Eng., Sunmoon Univ.) ;
  • Hong, S.S. (R&D Team, Acqutek Semiconductor and Technology Co., Ltd.) ;
  • Lee, J.W. (R&D Team, Acqutek Semiconductor and Technology Co., Ltd.) ;
  • Yang, H.W. (R&D Team, Acqutek Semiconductor and Technology Co., Ltd.) ;
  • Hahn, B.K. (R&D Team, Acqutek Semiconductor and Technology Co., Ltd.)
  • 발행 : 2006.12.31

초록

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

키워드

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