Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 13 Issue 4
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- Pages.57-63
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- 2006
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Cu Filling Characteristics of Trench Vias with Variations of Electrodeposition Parameters
Electrodeposition 변수에 따른 Trench Via의 Cu Filling 특성
- Lee, Kwang-Yong (Department of Materials Science and Engineering, Hongik University) ;
- Oh, Teck-Su (Department of Materials Science and Engineering, Hongik University) ;
- Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2006.12.30
Abstract
For chip-stack package applications, Cu filling characteristics into trench vias of
칩 스택 패키지의 삼차원 interconnection에 적용을 위해 폭