Journal of the Optical Society of Korea

  • 제10권3호
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  • Pages.124-129
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  • 2006
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  • 1226-4776(pISSN)
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  • 2093-6885(eISSN)
한국광학회 (Optical Society of Korea)
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Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process

  • Jeong, Ho-Seop (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Kim, Sung-Hwa (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Shin, Dong-Ik (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Lee, Seok-Cheon (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Jin, Young-Su (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Noh, Jung-Eun (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Oh, Hye-Ran (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Lee, Ki-Un (Optis Laboratory, Central R&D institute, Samsung electro-mechanics) ;
  • Song, Seok-Ho (BK21 Center, Department of Physics, Hanyang University) ;
  • Park, Woo-Je (BK21 Center, Department of Physics, Hanyang University)
  • 투고 : 2006.08.29
  • 발행 : 2006.09.25
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초록

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

키워드

참고문헌

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피인용 문헌

  1. Wafer-Level Hybrid Integration of Complex Micro-Optical Modules vol.5, pp.4, 2014, https://doi.org/10.3390/mi5020325