Effect of Bonding Temperature and Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Base Superalloy

니켈기 초내열 합금의 천이액상확산접합 특성에 미치는 접합 온도 및 가열 속도의 영향

  • 최우혁 (현대 종합금속주식회사) ;
  • 김성욱 (포항산업 과학연구원) ;
  • 김종현 (한양대학교 신소재공학부) ;
  • 김길영 (한양대학교 신소재공학부) ;
  • 이창희 (한양대학교 신소재공학부)
  • Published : 2005.04.01

Abstract

This study was carried out to investigate the effect of bonding temperature and heating rate on transient liquid phase diffusion bonding of Ni-base superalloy. The heating rate was varied by $0.1^{\circ}C$/sec, $1^{\circ}C$/sec, $10^{\circ}C$/sec to the bonding temperatures $1100^{\circ}C,\;1150^{\circ}C,\;1200^{\circ}C$ under vacuum. As bonding temperature increased, maximum dissolution width of base metal increased, but a dissolution finishing time decreased. The eutectic width of insert metal in the bonded interlayer decreased linearly in proportion to the square root of holding time during isothermal solidification stage. The bonding temperature was raised, isothermal solidification rate slightly increased. As the heating rate decreased and the bonding temperature increased, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification became reduced.

Keywords

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