International Journal of Korean Welding Society
- 제5권1호
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- Pages.15-28
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- 2005
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- 1598-1177(pISSN)
Standardization of the Important Test Parameters in the Solder Ball Shear Test for Evaluation of the Mechanical Joint Strength
- Kim J. W. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Koo J. M. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Lee W. B. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Moon W. C. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Moon J. H. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Yeon Y. M. (Suwon Science College) ;
- Shur C. C. (Department of Advanced Materials Engineering, Sungkyunkwan University) ;
- Jung S. B. (Department of Advanced Materials Engineering, Sungkyunkwan University)
- 발행 : 2005.03.01
초록
The ball shear test was investigated in terms of the effects of test parameters, i.e., shear height and shear speed, with an experimental and non-linear finite element analysis for evaluating the solder joint integrity of area array packages. Two representative Pb-free solder compositions were examined in this work: Sn-3.5Ag-0.75Cu and In-48Sn. The substrate was a common SMD type with solder bond pad openings of 460
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