SHEAH BOND STRENGTH OF VENEERING CERAMIC TO ELECTROFORMED GOLD WITH THREE DIFFERENT SURFACE TREATMENT

표면처리방법에 따른 전기성형금속의 도재결합강도

  • Kim Cheol (Department of Prosthodontics, Collage of Dentistry, Pusan National University) ;
  • Lim Jang-Seop (Department of Prosthodontics, Collage of Dentistry, Pusan National University) ;
  • Jeon Young-Chan (Department of Prosthodontics, Collage of Dentistry, Pusan National University) ;
  • Jeong Chang-Mo (Department of Prosthodontics, Collage of Dentistry, Pusan National University) ;
  • Jeong Hee-Chan (Department of Prosthodontics, Collage of Dentistry, Pusan National University)
  • 김철 (부산대학교 치과대학 치과보철학교실) ;
  • 임장섭 (부산대학교 치과대학 치과보철학교실) ;
  • 전영찬 (부산대학교 치과대학 치과보철학교실) ;
  • 정창모 (부산대학교 치과대학 치과보철학교실) ;
  • 정희찬 (부산대학교 치과대학 치과보철학교실)
  • Published : 2005.10.01

Abstract

Purpose: The success of the bonding between electroformed gold and ceramic is dependent on the surface treatment of the pure gold coping. The purpose of this study was to evaluate the bonding strength between the electroformed gold and ceramic with varying surface treatment. Materials and methods: A total of 32 disks,8 were using conventional ceramometal alloy, 24 were using electroforming technique as recommended by manufacturer, were prepared. 24 electroformed disks were divided 3 groups according to surface treatment, i.e. 50 microns aluminium oxide sandblasting(GES-Sand), gold bonder treatment(GES-Bond) and $Rocatec^{TM}$ system(GES-Rocatec). For control group of conventional alloy 50 microns aluminium oxide treatment was done(V-Supragold). Energy dispersive x-ray analysis and scanning electron microscope image were observed. Using universal testing machine, shear bond strength and bonding failure mode at metal-porcelain interface were measured. Results and Conclusion: The following conclusions were drawn: 1. In the energy dispersive x-ray analysis, the Au was main component in electroformed gold(99.9wt%). After surface treatment, a little amount of $Al_2O_3(2.4wt%)$ were found in GES-Sand, and $SiO_2(4wt%)$ in GES-Bond. In GES-Rocatec, however, a large amount of $SiO_2(17.4wt%)$ were found. 2. In the scanning electron microscopy, similar pattern of surface irregu larities were observed in V-Supragold and GES-Sand. In GES-Bond, surface irregularities were increased and globular ceramic particles were observed. In GES-Rocatec, a large amount of silica particles attached to metal surface with increased surface irregularities were observed. 3. The mean shear bond strength values(MPa) in order were $22.9{\pm}3.7(V-Supragold),\;22.1{\pm}3.8(GES-Bond),\;20.1{\pm}2.8(GES-Rocatec)\;and\;13.0{\pm}1.4(GES-Sand)$. There was no significant difference between V-Supragold, GES-Bond, and GES-Rocatec. (P>0.05) 4. Most bonding failures modes were adhesive type in GES-Sand. However, in V-Supragold, GES-Bond and GES-Rocatec, cohesive and combination failures were commonly observed. From the result, with proper surface treatment method electroformed gold may have enough strength compare to conventional ceramometal alloy.

Keywords

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