Clean Technology (청정기술)
- Volume 11 Issue 3
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- Pages.153-164
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- 2005
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- 1598-9712(pISSN)
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- 2288-0690(eISSN)
A Reliability Test for Pb-Free Plating Solution and its Deposit
Pb-Free 도금용액 및 피막의 신뢰성평가
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Hur, Jin-Young
(Korea institute of industrial technology, Nano surface technology team)
;
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Koo, Suck bone
(Korea institute of industrial technology, Nano surface technology team)
;
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Lee, Hong-Kee
(Korea institute of industrial technology, Nano surface technology team)
- Received : 2005.08.03
- Accepted : 2005.08.31
- Published : 2005.09.01
Abstract
This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.