니켈쌀파메이트 전주층의 실시간 잔류응력

Real-time Internal Stress of Nickel Sulfamate Electroform

  • 김인곤 (동의대학교 재료금속공학과) ;
  • 강경봉 (동의대학교 재료금속공학과) ;
  • 이재근 (동의대학교 재료금속공학과) ;
  • 권식철 (한국기계연구원 표면연구부) ;
  • 김만 (한국기계연구원 표면연구부) ;
  • 이주열 (한국기계연구원 표면연구부)
  • Kim I. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Kang K. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Lee J. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Kwon S.C. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Kim M. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Lee J.Y. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials)
  • 발행 : 2005.02.01

초록

The control of internal stress is extremely important in electroforming because of the deliberately low adhesion between the electro form and the mandrel. Excessive tensile or compressive stress can cause distortion, separation problem, curling, peeling or separation of electroform prematurely from the mandrel, buckling and blistering. Nickel sulfamate bath has been widely used in electroforming because of its low internal stress and moderate hardness. In this study, real-time stress sensor has been used for stress control in chloride-free nickel sulfamate bath for 400 mm x 300 mm x 500 ㎛ nickel electroform. It was found that compressive stress found at low current density indicated the contamination of electrolyte, which is very useful in procuring buckling and peeling of electroform. No compressive stress is allowed for plate electroform. The real-time stress can also be used for accurate stress control of nickel electroform. The tensile stress was found to be increased slightly with increase in nickel electroform thickness, i.e., from initial 1.47 ksi to 2.02 ksi at 320 ㎛.

키워드

참고문헌

  1. L. E. Vaaler, R. D. Galliher, R. G. Brown, D. G. Rider, Plating and Surface Finishing, March (1988)
  2. R. Weil, 'The Origins of Stress in Electrodeposits', Plating, Part I, Dec. (1970) pp. 1231-1237. Part II, Jan. (1971) pp. 50-56. Part III, Feb. (1971) pp. 137-146
  3. B. Stein, 'Fast and Accurate Deposit Internal Stress Determination' (1998) http://www.nicoform.com
  4. S. C. Fawcett, D. Engelhaupt, Precision Engineering, 17 (1995) 290-297 https://doi.org/10.1016/0141-6359(95)00018-9
  5. U.S. Patent 5,456,639 (1995)
  6. U.S. Patent 4,986,130 (1991)
  7. H. Feigenbaum, R. Weil, Plating and Surface Finishing, May (1979)
  8. G. Richardson, B. Stein, 1997 Electroforming Course & Symposium, San Diego, CA (1997)